Wärmeleitmaterialien
Gap Filler
Samples- Gap Filler
- Electrically non conductive
- Thermal conductivity up to 4.5 W/mK
- Handles tolerances of multi components
- Compensate unevenness e.g. between PCB and heat sink
- Material thickness from 0.3 mm to 10.0 mm
In order to provide you a fast sample delivery we keep the most popular materials on stock.
Selection - Gap Filler
Materialhärte [Shore 00]
Material Hardness
>> DS-GAP-BS62-1.0
>> DS-GAP-BS80-1.4
>> DS-GAP-BS60-1.7
>> DS-GAP-BS57-1.7
>> DS-GAP-BS60-2.0
>> DS-GAP-BS55-2.3
>> DS-GAP-AS55-3.0
>> DS-GAP-AS55-4.0
>> DS-GAP-AS65-4.5
>> DS-GAP-BS30-2.3
62
80
60
57
60
55
30
55
55
65
1.0 W/mK
2.0 W/mK
3.0 W/mK
4.0 W/mK
Gap Filler
DS-GAP-BS62-1.0
- Pads on sheet
- Pads on roll
- Low tacky on both sides
Delivery Form
DS-GAP-BS62-1.0
>> Back to selection
DS-GAP-BS55-2.3
Delivery Form
DS-GAP-BS55-2.3
- Pads on sheet
- Pads on roll
- Low tacky on both sides
>> Back to selection
DS-GAP-BS60-2.0
Delivery Form
DS-GAP-BS60-2.0
- Pads on sheet
- Pads on roll
- Low tacky on both sides
>> Back to selection
DS-GAP-BS57-1.7
Delivery Form
DS-GAP-BS57-1.7
- Pads on sheet
- Pads on roll
- Low tacky on both sides
>> Back to selection
DS-GAP-BS60-1.7
Delivery Form
DS-GAP-BS60-1.7
- Pads on sheet
- Pads on roll
- Low tacky on both sides
>> Back to selection
DS-GAP-BS80-1.4
Delivery Form
DS-GAP-BS80-1.4
- Pads on sheet
- Pads on roll
- Low tacky on both sides
>> Back to selection
DS-GAP-BS30-2.3
Delivery Form
DS-GAP-BS30-2.3
- Pads on sheet
- Pads on roll
- Low tacky on both sides
>> Back to selection
DS-GAP-AS55-3.0
- Pads on sheet
- Pads on roll
- One or two side adhesive
- Low tacky
- Non tacky
Delivery Form
DS-GAP-AS55-3.0
>> Back to selection
DS-GAP-AS55-4.0
Delivery Form
DS-GAP-AS55-4.0
>> Back to selection
- Pads on sheet
- Pads on roll
- One or two side adhesive
- Low tacky
- Non tacky
DS-GAP-AS65-4.5
Delivery Form
DS-GAP-AS65-4.5
>> Back to selection
- Pads on sheet
- Pads on roll
- One or two side adhesive
- Low tacky
- Non tacky
This information is not to be taken as warranty of representation for which we will assume legal responsibility nor permission or
recommendation to practice any patent invention without license. It is offered solely for your consideration, investigation and verification.
